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    Investigation of the use of meshfree methods for haptic thermal management of design and simulation of MEMS

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    This thesis presents a novel approach of using haptic sensing technology combined with virtual environment (VE) for the thermal management of Micro-Electro-Mechanical-Systems (MEMS) design. The goal is to reduce the development cycle by avoiding the costly iterative prototyping procedure. In this regard, we use haptic feedback with virtua lprototyping along with an immersing environment. We also aim to improve the productivity and capability of the designer to better grasp the phenomena operating at the micro-scale level, as well as to augment computational steering through haptic channels. To validate the concept of haptic thermal management, we have implemented a demonstrator with a user friendly interface which allows to intuitively "feel" the temperature field through our concept of haptic texturing. The temperature field in a simple MEMS component is modeled using finite element methods (FEM) or finite difference method (FDM) and the user is able to feel thermal expansion using a combination of different haptic feedback. In haptic application, the force rendering loop needs to be updated at a frequency of 1Khz in order to maintain continuity in the user perception. When using FEM or FDM for our three-dimensional model, the computational cost increases rapidly as the mesh size is reduced to ensure accuracy. Hence, it constrains the complexity of the physical model to approximate temperature or stress field solution. It would also be difficult to generate or refine the mesh in real time for CAD process. In order to circumvent the limitations due to the use of conventional mesh-based techniques and to avoid the bothersome task of generating and refining the mesh, we investigate the potential of meshfree methods in the context of our haptic application. We review and compare the different meshfree formulations against FEM mesh based technique. We have implemented the different methods for benchmarking thermal conduction and elastic problems. The main work of this thesis is to determine the relevance of the meshfree option in terms of flexibility of design and computational charge for haptic physical model
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